SMTA International Conference Proceedings


Author: Mathias Nowottnick et al.
Company: Fraunhofer IZM
Date Published: 9/21/2003   Conference: SMTA International

Abstract: The application of electronic assemblies is moving more and more in the "high temperature" range. For instance the automotive industry needs electronic units near the engine with 150°C operating temperature and more. Because these temperatures are to high for common standard solder joints, the development of new materials and technologies is required.

For the temperature region up to 150°C the use of special "reacting solders", a mixture of different alloys, is possible. During the soldering process the powder mixture can react and form a strengthened solder joint, with a higher melting point and improved thermo-mechanical properties.

The situation for operating temperatures higher than 200°C is completely different. For these applications normally solder alloys with a high lead content are preferred. Lead-free solder alloys with comparable melting temperatures are not announced today. A new alternative can be the combination of adhesive joints with solder joints, whereas the mechanical function will be realized mainly by the adhesive.

In contrast the solder joints can operate even in the liquid state, whereby the mechanical stress in the components hardly disappears. Low melting solder alloys are preferred especially for such "liquid solder joints". First applications for this new joining technology are under test today. Key words: high temperature, solder joints, soldering.

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