NEW ELECTROMIGRATION FAILURE MODE IN FLIP CHIP SOLDER JOINTSAuthor: Y. H. Lin et al.
Company: National Central University
Date Published: 9/21/2003 Conference: SMTA International
The dissolved Cu atoms were then driven by electrons to the anode side, and a large amount of Cu6Sn5 was formed there. To avoid this type of failure, another metal more resistant to dissolution should be used in place of or over Cu. Moreover, the geometry of the under bump metallurgy and conducting trace might have to be carefully designed to achieve a more uniform current distribution to reduce the effect of current crowding.
Key words: electromigration, flip chip, PbSn solder, dissolution.
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