SMTA International Conference Proceedings


Authors: Ronald C. Lasky, Ph.D., PE et al.
Company: Indium Corporation of America
Date Published: 9/21/2003   Conference: SMTA International

Abstract: Numerous studies have shown that greater than 60% of end of line defects in SMT assembly can be traced to solder paste and the printing process. Reflowing adds another 15% or so. In light of this fact, it is surprising that no simplified procedure for solder paste evaluation has been documented.

This paper is about such a procedure. By using designed experiments and the measurement of critical solder paste related process metrics, we were able to develop a solder paste evaluation procedure that maximizes information about the solder paste and its processability while minimizing experimentation. While using only 12 stencil printed PWBs, we were able to generate statistically significant results that enabled us to rank solder pastes according to their performance.

Response metrics that were investigated were print volume and definition before and after pause, squeegee hang up, slump, tack, release from aperture, and solder joint quality. In addition, we found such variation in solder paste volume repeatability that this criterion alone can be used as a screening procedure.

Key words: stencil printing, solder paste, and solder paste evaluation.

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