SMTA International Conference Proceedings


RELIABILITY OF 15MM, 0.65 MM PITCH MOLD ARRAY PROCESS (MAP) BALL GRID ARRAY (BGA) FOR AUTOMOTIVE APPLICATIONS

Authors: Patrice Langford and Thomas Koschmieder
Company: Motorola, Inc.
Date Published: 9/21/2003   Conference: SMTA International


Abstract: BGA packages are finding increased utilization as a package solution for automotive embedded microprocessors with pin counts above 160. Large pitch BGA packages with 1.27 and 1.00 mm pitch have been accepted by the automotive industry as reliable and now the effort is on reducing pitch to 0.8 and 0.65 mm to help with reducing the amount of board space needed. These packages must be manufactured to conservative automotive design guidelines and meet stringent automotive requirements for reliability. Meanwhile, pressures to minimize cost and time-to-market are demanding that reliability assessment begin earlier in the production cycle. One approach is to use test vehicles designed especially for package evaluation.

This paper addresses the reliability of a 15mm, 0.65mm pitch MAP BGA for automotive applications using daisy chain thermal-mechanical test vehicles designed for the continuous monitoring of solder balls. The effects of underfill versus no underfill, lead-free solder spheres versus SnPbAg solder spheres, and lead-free solder paste versus SnPb solder paste are evaluated under two thermal cycling conditions, -40 to +125oC and -50 to +150oC. Cycles to first failure and characteristic life are reviewed using Weibull plots. Failure analysis and failure mechanisms are also discussed.

Key words: BGA, solder joint, lead-free, automotive.



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