RELIABILITY OF 15MM, 0.65 MM PITCH MOLD ARRAY PROCESS (MAP) BALL GRID ARRAY (BGA) FOR AUTOMOTIVE APPLICATIONSAuthors: Patrice Langford and Thomas Koschmieder
Company: Motorola, Inc.
Date Published: 9/21/2003 Conference: SMTA International
This paper addresses the reliability of a 15mm, 0.65mm pitch MAP BGA for automotive applications using daisy chain thermal-mechanical test vehicles designed for the continuous monitoring of solder balls. The effects of underfill versus no underfill, lead-free solder spheres versus SnPbAg solder spheres, and lead-free solder paste versus SnPb solder paste are evaluated under two thermal cycling conditions, -40 to +125oC and -50 to +150oC. Cycles to first failure and characteristic life are reviewed using Weibull plots. Failure analysis and failure mechanisms are also discussed.
Key words: BGA, solder joint, lead-free, automotive.
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