SMTA International Conference Proceedings


PB FREE / HIGH TEMPERATURE REFLOW MSL PACKAGE ASSESSMENT OF A LGA PACKAGE ALTERNATIVE FOR PORTABLE PRODUCTS

Authors: Thomas Koschmieder and Fonzell Martin
Company: Motorola Semiconductor
Date Published: 9/21/2003   Conference: SMTA International


Seika Machinery, Inc.

Abstract: The hand-held consumer portable products market is driving towards more environmentally preferred packaging in anticipation of the implementation of the WEEE (Waste from Electrical and Electronic Equipment) directive from the European Parliament and it’s ban on the use of lead (Pb) by 2008. The Japan Product Markets are proactively pursuing Pb-free assemblies and predicts general use of Pb-free plastic packages in various new products in 2003. Concurrently, the package end-users also have confined space considerations requiring the use of low profile packaging solutions.

This report will discuss Land Grid Array solder joint reliability evaluations with focus on board mount assembly and component thermal cycling. This paper will discuss the practical advantages and disadvantages of a Land Grid Array package solution for the hand-held portable market. In an effort to meet MSL expectations, these studies were conducted while implementing advanced materials for fine pitch wire bonding, increased adhesion of BGA substrate interfaces, and finer substrate geometries.

Advanced mold compounds with finer fillers are used to insure adequate mold flow and reduce surface tension on silicon in an effort to improve moisture performance by improving adhesion between substrate interfaces. This creates challenges for packages to withstand higher temperature cycle ranges and higher reflow temperatures without introducing reliability failures such as trace cracking.



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