PB FREE / HIGH TEMPERATURE REFLOW MSL PACKAGE ASSESSMENT OF A LGA PACKAGE ALTERNATIVE FOR PORTABLE PRODUCTSAuthors: Thomas Koschmieder and Fonzell Martin
Company: Motorola Semiconductor
Date Published: 9/21/2003 Conference: SMTA International
This report will discuss Land Grid Array solder joint reliability evaluations with focus on board mount assembly and component thermal cycling. This paper will discuss the practical advantages and disadvantages of a Land Grid Array package solution for the hand-held portable market. In an effort to meet MSL expectations, these studies were conducted while implementing advanced materials for fine pitch wire bonding, increased adhesion of BGA substrate interfaces, and finer substrate geometries.
Advanced mold compounds with finer fillers are used to insure adequate mold flow and reduce surface tension on silicon in an effort to improve moisture performance by improving adhesion between substrate interfaces. This creates challenges for packages to withstand higher temperature cycle ranges and higher reflow temperatures without introducing reliability failures such as trace cracking.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.