HAND PLACING LEADLESS AND FINE PITCH LEADED COMPONENTS WITH SIPAD SOLID SOLDER DEPOSITIONAuthor: Matthew J. Kehoe
Company: SIPAD Systems
Date Published: 9/21/2003 Conference: SMTA International
ABSTRACT As the electronics industry continues to evolve and change, companies are being forced to adapt to maintain their current business, while attempting to develop new customers. Adaptation comes in different forms. It could be a larger building, a new piece of equipment, or a shift in philosophy, but the bottom line is, sometimes success depends on "a new order of things".
In the manufacturing of surface mount electronics, much has changed over the last 10 years. Components that were considered leading edge in 1993 don’t even exist any more. Devices 1/10 the size with 10 x the horsepower have become common place. Ultimately the new devices may meet the same fate as "the new order" evolves.
How can CEM’s and OEM’s keep up with the ever changing requirements demanded by their companies or customers? It is easy to throw money at a problem, buying better, more capable equipment to manufacture and verify your assemblies but in a time when money is tight and business slow, is that an option? Does your budget for 2003 include an x-ray machine, new stencil printer or more sophisticated chip shooter? Even if it does, will you be able to purchase this new equipment, get people trained on it, and pay for it while the industry is in a slump? Maybe? Maybe not.
A shrewd planner must be an innovator. Some call them a MacGyver. A company has to have a person that sorts through the sales pitches to find true innovation. Things that work better than the "old conditions" they are used to. Even if a company has an innovator, he or she may have to battle "enemies, all those who have done well under the old conditions". They may be co-workers, bosses, or even sales people offering advice based on selling their product versus solving your challenges.
Solid solder deposit has been around for 16 years, in the United States for 5 years. Some in our industry have even called it the "greatest idea that no body has ever heard of". SSD has proven successful as a "new order of things" for more than 50 companies that know about it and have sent their own innovators to the shop floor to see if it works. Yes you can place BGA and flip chip components. Yes you can hand place .4mm QFP, 0402, 0201 components. Rigid boards, flex cables, thin boards, thick boards, lead free, high temp, low temp. Assemblies that are cleaner, higher quality, and have better throughput than those produced by traditional hand paste and place methods.
This paper will explore solid solder deposition for BGA, LLP, and fine pitch leaded parts. Who is using SSD, how they are using it, and how it can be used by companies that are willing to consider the "new order of things" as an immediate, affordable, and easy to implement pathway to success.
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