ACOUSTIC MICROSCOPY OF FLIP CHIP PACKAGESAuthor: Joel Sigmund
Company: SONIX INC.
Date Published: 2/2/1999 Conference: Pan Pacific Symposium
A need has arisen for a nondestructive tool which is capable of examining the integrity of flip chip interfaces. Acoustic microscopes now play an important role in the assembly of flip chip packages because they can look underneath the chip at the critical interfaces without cutting the package. Package defects such as underfill voiding, interconnect bump voiding, delamination, flux residue and alignment of bump to substrate metallization are detectable using a scanning acoustic microscope. This work summarizes the application of a digital scanning acoustic microscope on specific flip chip packaging problems.
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