FLIP CHIP ON STANDARD LEAD FRAME: LOWERING THE COST OF FLIP CHIP OWNERSHIPAuthor: Frank Juskey
Company: AIT, Inc.
Date Published: 9/21/2003 Conference: SMTA International
This paper discusses the advent of FC technology in low cost lead frame based IC packages for wireless, automotive and consumer electronic applications. By selectively engineering the die layout and by applying new and improved redistribution, bumping, and assembly technologies it is possible to take non-pad limited die and redistribute its I/O to a 200, 300, or 400 micron pitch and use the existing conventional lead frame IC packages infrastructure.
The abbreviated assembly process and the re-use of existing tooling allows for a significant reduction in overall tooling charges. These new IC packages while having the same outward appearance, have a significant improvement in moisture sensitivity level (MSL), electrical performance, and in many instances where the die can be exposed, improved thermal performance at a cost significantly below that of laminate based FC technology.
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