SOLDER JOINT RELIABILITY ASSESMENT OF Sn-Ag-Cu BGA COMPONENTS ATTACHED WITH EUTECTIC Pb-Sn SOLDERAuthor: Fay Hua et al.
Company: Intel Corporation
Date Published: 9/21/2003 Conference: SMTA International
The packages were assembled under various board reflow profiles using standard Pb-Sn assembly conditions. Peak reflow temperatures varied from 208°C to 222°C with a soak profile or a direct ramp up profile. These reflow profiles result in either a homogenous microstructure of the solder joint because of the melting and collapse of the Sn-Ag-Cu BGA balls or a non-homogenous microstructure due to partial melting and collapse of the BGA balls. The solder joint reliability (SJR) was evaluated in terms of resistance to failure by subjecting assemblies to temperature cycles (-40 °C to 125°C, 30 minutes per cycle) and mechanical shock testing. Results from this SJR testing and detailed failure analysis are reported.
Key words: solder joints, reliability, BGAs, Pb-free, Pb-Sn and Sn-Ag-Cu solder compatibility.
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