THIN ARRAY POLYMER PACKAGING FOR RF MODULESAuthors: Leo M. Higgins III, Ph.D
Company: ASAT, Inc.
Date Published: 9/21/2003 Conference: SMTA International
New packaging technology has been developed that exploits standard additive plating for high density circuits, and transfer molding to create very high density single die and multi-component packaging, without the need for leadframe or substrate components. Recent advancements have added stacked component functionality, integrated passives, and integrated EMI shield elements into low profile, and low mass modular system packaging (MSP). The structures, manufacturing processes, and benefits of this novel packaging are discussed in this paper.
Key words: system in package, SIP, multichip module, MCM, stack packaging, RF module, RF packaging, polymer packaging.
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