SMTA International Conference Proceedings


Authors: Leo M. Higgins III, Ph.D
Company: ASAT, Inc.
Date Published: 9/21/2003   Conference: SMTA International

Abstract: With the explosive growth of portable wireless electronic products, RF packaging has been ‘consumerized’. While RF packaging has always required careful design, resulting in compact components, widespread consumer sales have forced even greater attention on reduction in package size and mass, while requiring highly efficient, low loss interconnects, to meet system performance requirements and extended battery demands.

New packaging technology has been developed that exploits standard additive plating for high density circuits, and transfer molding to create very high density single die and multi-component packaging, without the need for leadframe or substrate components. Recent advancements have added stacked component functionality, integrated passives, and integrated EMI shield elements into low profile, and low mass modular system packaging (MSP). The structures, manufacturing processes, and benefits of this novel packaging are discussed in this paper.

Key words: system in package, SIP, multichip module, MCM, stack packaging, RF module, RF packaging, polymer packaging.

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