SMTA International Conference Proceedings


TOWARDS WAFER-SCALE MEMS PACKAGING: A REVIEW OF RECENT ADVANCES

Authors: John Heck and Steve Greathouse
Company: Intel Corporation
Date Published: 9/21/2003   Conference: SMTA International


Abstract: The wide variety of MEMS industries, from automotive sensors to displays, has long been following on and benefiting from the existing infrastructure of the IC industry. This is especially true in the area of packaging, which the IC industry has considered separately from fabrication. However, unlike in IC technology, the fabrication of MEMS devices with moving parts, and the sealing of these parts into a package must be considered simultaneously.

In this paper, we will examine several approaches that have been used in the MEMS industry to address the "release and sealing" process. We argue that the best solutions to these challenges lie in wafer level packaging. We will then discuss the main types of wafer-level package configurations and processes, and discuss their advantages and disadvantages. Finally, two examples of Intel’s packaged MEMS devices will be presented.

Key words: MEMS, wafer-level packaging, sealing, wafer bonding.



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