TOWARDS WAFER-SCALE MEMS PACKAGING: A REVIEW OF RECENT ADVANCESAuthors: John Heck and Steve Greathouse
Company: Intel Corporation
Date Published: 9/21/2003 Conference: SMTA International
In this paper, we will examine several approaches that have been used in the MEMS industry to address the "release and sealing" process. We argue that the best solutions to these challenges lie in wafer level packaging. We will then discuss the main types of wafer-level package configurations and processes, and discuss their advantages and disadvantages. Finally, two examples of Intel’s packaged MEMS devices will be presented.
Key words: MEMS, wafer-level packaging, sealing, wafer bonding.
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