SMTA International Conference Proceedings


ROLE OF HDPUG IN LEAD-FREE TRANSITION

Author: Vivek Gupta
Company: Intel Corporation
Date Published: 9/21/2003   Conference: SMTA International


Abstract: The European Union (EU) formally adopted the WEEE and ROHS directives effective July 1, 2006. The introduction of Pb-free products is already occurring worldwide driven by marketing as well as regulatory forces. Even with these initial gains, the task of elimination of the ubiquitous SnPb solder from over 200,000 electronic products and introduction of lead-free solders is a complex and massive undertaking.

We not only need to solve technical issues, ensure adequate reliability and develop the Pb-free process, but also manage the logistics of conversion of the entire supply chain with intricate interdependencies. This paper discusses the efforts by High Density Packaging Users Group (HDPUG) to address the issues involved in solving the Pb-free problem in a coordinated manner.

Key words: Pb-free, lead-free, transition, RoHS, board process.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819