SMTA International Conference Proceedings


Authors: Reza Ghaffarian, Ph.D.
Company: Jet Propulsion Laboratory
Date Published: 9/21/2003   Conference: SMTA International

Abstract: For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray imaging has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic array packages such as ball grid array (BGAs) and chip scale packages (CSPs).

Lead-free and eutectic lead/tin based soldered assemblies with conventional package, BGA, and CGA (ceramic column grid) were built for inspection by optical and X-ray before and at intervals during thermal cycling with different levels of damage/cracking. Two different 2D real time xrays were used. The optical images for leaded and leadless assemblies as well as those taken for outer rows of area arrays were compared for several solder compositions.

These were compared to those inspected by x-ray to understand ability of x-ray for detection of damage/cracking due to thermal cycles. Optical, scanning electron microscopy (SEM), and X-ray photomicrographs for various assemblies were also presented.

Key words: inspection, x-ray, ceramic column grid array, CCGA, CGA, solder joint, thermal cycle, lead free, Pb free.

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