SMTA International Conference Proceedings


VIBRATION BEHAVIOR OF CSP ASSEMBLIES WITH AND WITHOUT UNDERFILL

Authors: Reza Ghaffarian, Ph.D. and *Namsoo Kim
Company: Jet Propulsion Lab and *Boeing
Date Published: 9/21/2003   Conference: SMTA International


Abstract: The test results for numerous chip scale package assemblies performed under the MicrotypeBGAConsortium led by the Jet Propulsion Laboratory have been published previously. Cycles-to-failure (CTF) of assemblies with underfill to 3,000 cycles of -30 to 100°C and 1500 in the range of -55 to 125°C are presented.

Virgin assemblies with numerous chip scale packages and a control TSOP were also subjected to two vibration levels for up to 6 hours to characterize their times-tofailure (TTF). Assemblies with and without underfill were tested. This paper presents the vibration behavior of these assemblies along with optical and SEM crosssectional micrographs taken after failure.

Key words: vibration, CSP, microBGA, TSOP, underfill, solder joint reliability, thermal cycle.



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