VIBRATION BEHAVIOR OF CSP ASSEMBLIES WITH AND WITHOUT UNDERFILLAuthors: Reza Ghaffarian, Ph.D. and *Namsoo Kim
Company: Jet Propulsion Lab and *Boeing
Date Published: 9/21/2003 Conference: SMTA International
Virgin assemblies with numerous chip scale packages and a control TSOP were also subjected to two vibration levels for up to 6 hours to characterize their times-tofailure (TTF). Assemblies with and without underfill were tested. This paper presents the vibration behavior of these assemblies along with optical and SEM crosssectional micrographs taken after failure.
Key words: vibration, CSP, microBGA, TSOP, underfill, solder joint reliability, thermal cycle.
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