SMTA International Conference Proceedings


Author: Jim Fraivillig
Company: Fraivillig Technologies
Date Published: 9/21/2003   Conference: SMTA International

Abstract: PowerVia(TM) thermal columns are solid-metal, electrically-isolated thermal vias. When used in a conventional surface-mount printed circuit board (PCB), PowerVias improve power device cooling, and offer design options and enhanced manufacturability in electronic packaging.

PowerVias allow the attachment of a fully-assembled FR4 printed circuit board onto a heat sink with the thermal path between the power device and the heat sink impeded by only 1.3 mils of dielectric film, which is integrated into the PCB. The thermal resistance of the PowerVia is 1-2oC/W, depending on the model.

PowerVias can eliminate the need for through-hole mounting of power devices into a surface-mount PCB. This avoids the subsequent (often clumsy) grappling with the independent cooling and electrical isolation requirements of the through-hole devices.

Key words: power electronics, thermal vias, power device cooling, thermal management.

Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819