SOLID-METAL THERMAL COLUMNS IN CONVENTIONAL PCBsAuthor: Jim Fraivillig
Company: Fraivillig Technologies
Date Published: 9/21/2003 Conference: SMTA International
PowerVias allow the attachment of a fully-assembled FR4 printed circuit board onto a heat sink with the thermal path between the power device and the heat sink impeded by only 1.3 mils of dielectric film, which is integrated into the PCB. The thermal resistance of the PowerVia is 1-2oC/W, depending on the model.
PowerVias can eliminate the need for through-hole mounting of power devices into a surface-mount PCB. This avoids the subsequent (often clumsy) grappling with the independent cooling and electrical isolation requirements of the through-hole devices.
Key words: power electronics, thermal vias, power device cooling, thermal management.
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