SMTA International Conference Proceedings


EFFECT OF PRINTED WIRING BOARD WARPAGE ON BALL GRID ARRAYS OVER TEMPERATURE

Authors: Kyra Ewer and Jeffrey Seekatz
Company: Raytheon
Date Published: 9/21/2003   Conference: SMTA International


Abstract: A study was undertaken to determine the extent to which a printed wiring board will warp during reflow, and the effect this may have upon ball grid arrays being soldered to the board. One of the goals was to determine if a correlation existed between printed wiring board warp and electrical opens on ball grid arrays.

Key words: BGA, electrical opens, warpage, printed wiring board.



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