EVALUATION OF SEMICONDUCTOR PACKAGE RELIABILITY WITH FOUR METAL LAYER PLASTIC BALL GRID ARRAY LAMINATE SUBSTRATESAuthor: Lucy Grace Dearce et al.
Company: Motorola Semiconductor
Date Published: 9/21/2003 Conference: SMTA International
Temperature cycling, in particular, induces cracking within the substrate that can be mitigated through improvements in the substrate manufacturing process and strategic package materials selection. Temperature cycling life can be extended by optimizing the copper plating process and using advanced solder mask, organic core, and via fill materials.
This paper investigates the performance of four metal layer PBGA packages in temperature cycling and other reliability stresses and offers recommendations for added robustness including the usage of halide-free materials.
Key words: PBGA, temperature cycling, via cracking, multi-layer substrate.
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