SMTA International Conference Proceedings


EVALUATION OF SEMICONDUCTOR PACKAGE RELIABILITY WITH FOUR METAL LAYER PLASTIC BALL GRID ARRAY LAMINATE SUBSTRATES

Author: Lucy Grace Dearce et al.
Company: Motorola Semiconductor
Date Published: 9/21/2003   Conference: SMTA International


Abstract: Laminate-based, multi-metal layer substrates are used in electronic component manufacturing to improve both thermal and electrical performance of the package and to aid in routing high I/O count devices to a customer printed circuit board through a solder ball array. Plastic ball grid array (PBGA) packages that use these substrates must meet rigorous reliability requirements in the automotive industry.

Temperature cycling, in particular, induces cracking within the substrate that can be mitigated through improvements in the substrate manufacturing process and strategic package materials selection. Temperature cycling life can be extended by optimizing the copper plating process and using advanced solder mask, organic core, and via fill materials.

This paper investigates the performance of four metal layer PBGA packages in temperature cycling and other reliability stresses and offers recommendations for added robustness including the usage of halide-free materials.

Key words: PBGA, temperature cycling, via cracking, multi-layer substrate.



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