SMTA International Conference Proceedings


Author: Shean R. Dalton
Company: Electrovert Speedline Tech.
Date Published: 9/21/2003   Conference: SMTA International

Abstract: With the proliferation of advanced packages, along with the continued integration of traditionally mechanical functions into electromechanical assemblies, the cleaning process continues to face new difficulties. Low standoff area array packages, blind connectors, encased relays, bulky heat sinks are all examples of difficult to penetrate and difficult to dry components used on today’s assemblies. A cleaning system’s capabilities must be developed to extend the performance window beyond the challenges posed by these technologies, while not exceeding a value proposition.

Traditionally, increased cleaning performance capabilities are gained with directly proportional increases in cost of ownership. This paper will discuss new equipment innovations in drying technology. These patent pending innovations will show increased performance capabilities, which are delivered with inverse proportions to cost of ownership.

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