HIGH PIN COUNT POWER PACKAGE FOR HIGH CURRENT, HIGH TEMPERATURE AUTOMOTIVE APPLICATIONSAuthor: Paolo Casati et al.
Date Published: 9/21/2003 Conference: SMTA International
In this paper, the failure mechanism associated with high currents and high temperatures in plastic packages are described. A new power surface mount package HiQUAD-92 is developed to meet the automotive market requirements power dissipation and high temperature reliability (up to 180°C). Thermal management, current management and reliability under high temperature and high current are presented.
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