SMTA International Conference Proceedings


HIGH PIN COUNT POWER PACKAGE FOR HIGH CURRENT, HIGH TEMPERATURE AUTOMOTIVE APPLICATIONS

Author: Paolo Casati et al.
Company: STMicroelectronics
Date Published: 9/21/2003   Conference: SMTA International


Abstract: New generation of engine management control units and car safety systems (ECU modules) for mechatronics environments involve mixed technology system-on-a-chip (SOC) fabrication, which seems to be a valid approach compared to design partitioned into multiple devices. Many automotive applications involve high power dissipation (>5 Watts), high operating temperatures (>150 °C) and medium to high I/O counts (64-100). This poses a challenge for electronic component package design.

In this paper, the failure mechanism associated with high currents and high temperatures in plastic packages are described. A new power surface mount package HiQUAD-92 is developed to meet the automotive market requirements power dissipation and high temperature reliability (up to 180°C). Thermal management, current management and reliability under high temperature and high current are presented.



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