Pan Pacific Symposium Conference Proceedings


Author: Santhana S. Satagopan
Company: Bay Networks
Date Published: 2/2/1999   Conference: Pan Pacific Symposium

Abstract: High speed networking technologies are driving the needs for faster, electromagnetic interference (EMI) compliant application specific integrated circuits (ASIC) with better thermal dissipation and large 1/0 counts (>600). Higher densities also drive the need for bottom side BGA assembly. A cross-functional team was formed to evaluate the interconnect robustness of different package types that meet the aforementioned needs. A test vehicle was designed and populated with large 1/0 eutectic BGA packages on the top and smaller BGA packages on the bottom side. Four different types of BGA packages were used on the top side. Their sizes ranged from 37.5 to 45 mm square. Two different pad sizes: 20 and 30 mil circular, were designed on the board to understand the significance of stand off height on the interconnect reliability. On the bottom side, two types of standard plastic BGA packages were used. A total of six boards were built. Half of these boards were reworked on the top side using industry standard rework practices. The boards were then subjected to air-to-air thermal shock from O'C to 100'C. Furthermore, these samples were subjected to random vibration ftom 4Grms till 12Gnns. Failure analysis was conducted to better understand the modes of failure. This paper presents the methodology, observations and results of this evaluation. Keywords: BGA, ASIC, Warpage, Rework, Routing

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