IMPLICATIONS OF USING LEAD-FREE SOLDERS ON X-RAY INSPECTION OF FLIP CHIPS AND BGASAuthor: David Bernard
Company: Dage Precision Industries
Date Published: 9/21/2003 Conference: SMTA International
However, the test and inspection equipment, and methods, used for decades may not now be appropriate for this new challenge. This may be because, at worst, some test parameters are no longer valid with the lead-free solders, or, less seriously, the inspection control settings must be varied to accept revised test responses based on acceptable levels for these new materials. Implementing lead-free solder into production, therefore, raises questions as to the acceptability and adequacy of a company’s existing test methods.
This paper discusses the implications of using x-ray inspection on lead-free versions of flip chips and BGAs.
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