SMTA International Conference Proceedings


IMPLICATIONS OF USING LEAD-FREE SOLDERS ON X-RAY INSPECTION OF FLIP CHIPS AND BGAS

Author: David Bernard
Company: Dage Precision Industries
Date Published: 9/21/2003   Conference: SMTA International


Abstract: All contract manufacturers (CM) of printed circuit boards (PCBs) are having to consider their approach to using lead-free solders to meet current, and future, environmental, legislative and market demands. As these lead-free solders have markedly different operating parameters from those of the tried and tested lead-containing solders, the opportunity for production problems rises. Therefore, the application of appropriate test and inspection procedures now becomes even more important to ensuring product quality and reliability.

However, the test and inspection equipment, and methods, used for decades may not now be appropriate for this new challenge. This may be because, at worst, some test parameters are no longer valid with the lead-free solders, or, less seriously, the inspection control settings must be varied to accept revised test responses based on acceptable levels for these new materials. Implementing lead-free solder into production, therefore, raises questions as to the acceptability and adequacy of a company’s existing test methods.

This paper discusses the implications of using x-ray inspection on lead-free versions of flip chips and BGAs.



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