CHARACTERIZATION OF MECHANICAL PERFORMANCE OF SN/AG/CU SOLDER JOINTS WITH DIFFERENT COMPONENT LEAD COATINGSAuthor: Minna Arra et al.
Company: Flextronics International
Date Published: 9/21/2003 Conference: SMTA International
In the lead pull test, components with Ni/Pd/Au coating yielded the highest pull strengths. Failure modes and the structure of the coating surfaces were examined from cross-sectioned samples using scanning electron microscope (SEM). Failures in both tests proceeded mainly through the intermetallic compound (IMC) layer.
Furthermore, the wetting of the leads by the solder and the thickness of IMC layers were studied. Better wetting and thus larger interfacial area between the lead and solder improved the strength of the joints in both tests.
Key words: lead-free, Sn/Ag/Cu, solder joint, mechanical.
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