SMTA International Conference Proceedings


CHARACTERIZATION OF MECHANICAL PERFORMANCE OF SN/AG/CU SOLDER JOINTS WITH DIFFERENT COMPONENT LEAD COATINGS

Author: Minna Arra et al.
Company: Flextronics International
Date Published: 9/21/2003   Conference: SMTA International


Abstract: Mechanical properties of Sn/Ag/Cu solder joints in combination with different component lead coating materials (Ni/Pd/Au, Sn/15%Pb and Sn/2%Bi, and Sn) were studied in this work using a lead pull test and a free fall drop test. The results of this study show that the Sn/2%Bi coated components provide the best performance under the drop impact loading followed by the Sn/15%Pb, matte Sn and Ni/Pd/Au coated components.

In the lead pull test, components with Ni/Pd/Au coating yielded the highest pull strengths. Failure modes and the structure of the coating surfaces were examined from cross-sectioned samples using scanning electron microscope (SEM). Failures in both tests proceeded mainly through the intermetallic compound (IMC) layer.

Furthermore, the wetting of the leads by the solder and the thickness of IMC layers were studied. Better wetting and thus larger interfacial area between the lead and solder improved the strength of the joints in both tests.

Key words: lead-free, Sn/Ag/Cu, solder joint, mechanical.



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