Academic Student Compendium Conference Proceedings


Issues in Assembly and Reliability of High I/O (1500+) Flip Chip BGAs

Authors: Arun Gowda and Dr. K. Srihari
Company: State University of New York
Date Published: 8/6/2003   Conference: Academic Student Compendium


Abstract: 

Introduction
  • High I/O Organic Flip Chip BGAs (FCBGAs)
    - High Functionality, Density, and Module I/O for High-end Information Systems and Communications Applications.
  • Assembly and Reliability Concerns due to
    - Complex Construction, High I/O Density, Large Package Size, Heat Spreader/Sink Attachment.
  • Research Addresses
    - Assembly Related Issues - Effects of Different Assembly Parameters.
    - Thermal Cycling and Mechanical Reliability -Effects of Different Package Constructions and Assembly Related Factors.
  • Multiple Failure Mechanisms Associated with High I/O Organic Area Array Devices with First Level Flip Chip Interconnections.

    Experimentation in Progress - Research Plan and Initial Results are Presented.

    Research Overview

  • Experiment Design
  • Package Characterization
  • Test Vehicle Design
  • Assembly
  • Post Assembly Characterization
  • Reliability Evaluation
  • Failure Analysis
  • Rework Process Research
  • Documentation


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