Issues in Assembly and Reliability of High I/O (1500+) Flip Chip BGAsAuthors: Arun Gowda and Dr. K. Srihari
Company: State University of New York
Date Published: 8/6/2003 Conference: Academic Student Compendium
- High Functionality, Density, and Module I/O for High-end Information Systems and Communications Applications.
- Complex Construction, High I/O Density, Large Package Size, Heat Spreader/Sink Attachment.
- Assembly Related Issues - Effects of Different Assembly Parameters.
- Thermal Cycling and Mechanical Reliability -Effects of Different Package Constructions and Assembly Related Factors.
Experimentation in Progress - Research Plan and Initial Results are Presented.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.