Academic Student Compendium Conference Proceedings


Wafer Applied Reworkable Underfill for Direct Chip Attach

Authors: Renzhe Zhao and R. Wayne Johnson
Company: Auburn University
Date Published: 8/6/2003   Conference: Academic Student Compendium


Abstract: 

Introduction
  • Flip-Chip-On-Laminate Assembly
  • Capillary Flow Underfill Process
  • Wafer Level Applied Underfill Process
  • Experimentation

  • Coating
  • Assembly
  • Modeling

  • Solder Bump Geometry
  • Normal Reaction Force and Restoring Force
  • Fillet Geometry and Fillet Force
  • Multiple Ball Array Model
  • Prediction of Die-standoff and Coating Thickness
  • Conclusion

  • The wafer level applied underfill process has obvious advantages over conventional capillary flow process.
  • The key issues in the wafer level applied underfill process were discussed and experimental results were presented.
  • Models were developed to simulate the assembly process and to predict the die-standoff and coating thickness.
  • The modelvs serve as a guide in the development of underfills with the desired properties.


  • Members download articles for free:

    Not a member yet?

    What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

    Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


    Back


    SMTA Headquarters
    6600 City West Parkway, Suite 300
    Eden Prairie, MN 55344 USA

    Phone +1 952.920.7682
    Fax +1 952.926.1819