Wafer Applied Reworkable Underfill for Direct Chip Attach
Authors: Renzhe Zhao and R. Wayne Johnson
Company: Auburn University
Date Published: 8/6/2003
Academic Student Compendium
Introduction Flip-Chip-On-Laminate Assembly Capillary Flow Underfill Process Wafer Level Applied Underfill Process
ModelingSolder Bump Geometry Normal Reaction Force and Restoring Force Fillet Geometry and Fillet Force Multiple Ball Array Model Prediction of Die-standoff and Coating Thickness
ConclusionThe wafer level applied underfill process has obvious advantages over conventional capillary flow process. The key issues in the wafer level applied underfill process were discussed and experimental results were presented. Models were developed to simulate the assembly process and to predict the die-standoff and coating thickness. The modelvs serve as a guide in the development of underfills with the desired properties.
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