Academic Student Compendium Conference Proceedings


Cost Savings Using Design for Environment in the Electronic Packaging Industry

Authors: Xu Yuliang and James Bartlett
Company: North Dakota State University
Date Published: 8/6/2003   Conference: Academic Student Compendium


Abstract: Design for Environment (DFE) has been an area of emerging interest for electronics manufacturers in recent years. An important aspect of DFE is the linkage of manufacturing process, waste emissions and energy consumption with parameters in product design. In this research, DFE software was used to analyze the environmental impacts on the whole assembly process, including both surface mount and through hole technology to point toward design and process improvements.

A typical PCB product was improved based on environmental issues using the DFE software and the cost saving were estimated in contrast to the initial design. DFE guidelines were developed for electronics assembly to improve life-cycle thinking with consideration of product and process environmental impacts and costs.

Key words: DFE, LCA (life cycle analysis), PCB (printed circuit board).



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