JOINT RELIABILITY OF FLIP CHIP INTERCONNECTION WITH SN-BI SOLDERAuthors: T. Akamatsu, H. Ueda, M. Ochiai, and E. Horikoshi
Company: Fujitsu Laboratories Ltd.
Date Published: 2/18/2003 Conference: Pan Pacific Symposium
Therefore it appears that short circuits resulting from volume increase between bumps were preventable. Additionally, we investigated the effect of adding Ag into Sn-Bi eutectic solder, in an attempt to improve its elongation property. We examined the fatigue property mechanism that Ag gave to the Sn-Bi alloy characteristic. We found optimum concentration of Ag in Sn-Bi-Ag solder. We then demonstrated the joint reliability of the flip chip interconnection with an Sn-Bi solder bump. We performed a thermal cycle test. After this testing, we were able to confirm that Sn-Bi solder joint reliability equal to that of Sn-Ag-Cu system solder had been achieved.
Key words: Sn-Bi, flip-chip, reflow.
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