SIGNAL INTEGRITY SYSTEM SOLUTIONS FOR HIGH SPEED BACKPLANE TRANSMISSION AND CONNECTORS INTEGRATED IN PACKAGESAuthor: Josh G. Nickel et al.
Company: Silicon Bandwidth
Date Published: 2/18/2003 Conference: Pan Pacific Symposium
In this paper, we present several innovative enabling technologies useful in the development of high-speed systems. We focus on connectors integrated into packages, a new 10 GHz multi-configuration backplane connector, and finally a printed circuit board (PCB) and substrate technology which radically reduces via structures and layer counts which in turn reduces PCB costs, while improving signal integrity.
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