Pan Pacific Symposium Conference Proceedings


SIGNAL INTEGRITY SYSTEM SOLUTIONS FOR HIGH SPEED BACKPLANE TRANSMISSION AND CONNECTORS INTEGRATED IN PACKAGES

Author: Josh G. Nickel et al.
Company: Silicon Bandwidth
Date Published: 2/18/2003   Conference: Pan Pacific Symposium


Abstract: Exploding consumer demands for high bandwidth necessitate ever higher signaling speeds. However, traditional board, connector, and packaging technologies have reached their limits in terms of acceptable signal integrity. Legacy solutions, exotic materials, active backplanes, and signaling tricks are cost-prohibitive and overly complex. In many cases, signal integrity demands significant design revisions and careful consideration of new three-dimensional structures, which will more effectively address these needs.

In this paper, we present several innovative enabling technologies useful in the development of high-speed systems. We focus on connectors integrated into packages, a new 10 GHz multi-configuration backplane connector, and finally a printed circuit board (PCB) and substrate technology which radically reduces via structures and layer counts which in turn reduces PCB costs, while improving signal integrity.



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