EVALUATION OF MEMS (MICRO-ELECTRO-MECHANICAL SYSTEMS) USING ACOUSTIC MICRO IMAGINGAuthors: Janet E. Semmens and Lawrence W. Kessler
Company: Sonoscan, Inc.
Date Published: 2/18/2003 Conference: Pan Pacific Symposium
Acoustic Micro Imaging (AMI) has become an established method to evaluate the quality and reliability of IC packages from the standpoint of package integrity. Ultrasound is sensitive to variations in the elastic properties of materials and is particularly sensitive to locating air gaps (delaminations and voids).
Since there are a number of similarities in the packaging of MEMS and IC devices AMI is proving a valuable tool in the non-destructive analysis of MEMS. However the construction and packaging of MEMS is often more complex than typical IC packages which presents certain challenges for AMI inspection. Therefore, the AMI techniques of examining the devices had to evolve to accommodate the changes.
This paper will discuss AMI techniques pertinent to MEMS and a survey of applications.
Key words: acoustic micro imaging, MEMS, delamination.
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