Pan Pacific Symposium Conference Proceedings


SIX-SIGMA PROCESS DEVELOPMENT FOR SOLDER PASTE DEPOSITION IN A HIGH VOLUME - LOW MIX SMT LINE

Author: Sharafali Shaherwala et al.
Company: State University of New York
Date Published: 2/18/2003   Conference: Pan Pacific Symposium


Abstract: Surface Mount Technology (SMT) is the predominant technology for the assembly of electronic devices. Maintaining existing quality levels and exceeding continuously increasing customer expectations vis-à-vis quality is necessary to retain and develop additional business.

The integration of a program based on six-sigma principles for continuous improvement in a high volume-low mix Electronic Manufacturing Services (EMS) environment is discussed in this paper. The DMAIC (Define, Measure, Analyze, Improve and Control) approach was adopted to ensure that the improvement program was well structured. Subsequently, the output was verified by means of a case study. Based on the analysis conducted, a pilot production run was conducted.

Historical defect data analysis and process knowledge resulted in the identification of the solder paste deposition step as the principal focus for quality improvement. The quality metrics and the process measurement systems were initially reviewed for their adequacy. Subsequently, the stencil printing process parameters were ‘optimized’. Operational issues were identified and addressed.

Key words: six-sigma, DMAIC, SMT, solder paste deposition, and process optimization.



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