Pan Pacific Symposium Conference Proceedings


LOW COST HIGH PERFORMANCE BGA - C2BGA

Author: William Rugg et al.
Company: Seagate Technology
Date Published: 2/18/2003   Conference: Pan Pacific Symposium


Abstract: Conduction cooled BGA (C2BGA) is presented as a low cost and high thermal performance cavity up PBGA. The package features a heat slug attached at the bottom of the substrate. Low cost is achieved by utilizing conventional materials and processes to produce the C2BGA. During surface mount assembly, the heat slug shall be soldered to the ground pad of the printed circuit board (PCB) to achieve a very low thermal resistance.

Thermal performance of C2BGA is presented in comparison with an exposed pad TQFP (epad TQFP) and a conventional BGA for a hard disk drive (HDD) application.



Members download articles for free:

Not a member yet?

What else do you get when you join SMTA? Read about all of the benefits that go along with membership.

Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.


Back


SMTA Headquarters
6600 City West Parkway, Suite 300
Eden Prairie, MN 55344 USA

Phone +1 952.920.7682
Fax +1 952.926.1819