Pan Pacific Symposium Conference Proceedings


Author: William Rugg et al.
Company: Seagate Technology
Date Published: 2/18/2003   Conference: Pan Pacific Symposium

Abstract: Conduction cooled BGA (C2BGA) is presented as a low cost and high thermal performance cavity up PBGA. The package features a heat slug attached at the bottom of the substrate. Low cost is achieved by utilizing conventional materials and processes to produce the C2BGA. During surface mount assembly, the heat slug shall be soldered to the ground pad of the printed circuit board (PCB) to achieve a very low thermal resistance.

Thermal performance of C2BGA is presented in comparison with an exposed pad TQFP (epad TQFP) and a conventional BGA for a hard disk drive (HDD) application.

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