TEMPERATURE EFFECTS ON ENCAPSULANT DISPENSINGAuthor: Horatio Quinones
Date Published: 2/2/1999 Conference: Pan Pacific Symposium
Although extensive data exists on encapsulant material characterization, including time and temperature dependencies (i.e., viscosity, Tg, CTE, etc.), not as much is known on the subject of the thermal effects on the actual process of dispensing. Using a model of a popular cavity-down ball grid array package design with several different sources of encapsulant heating, this paper will present experimental results on how best to heat the encapsulant and package to enhance flowout and to optimize surface flatness. The principle focus is on investigation of heating the substrate, the needle and the fluid chamber (prior to dispensing).
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