TECHNOLOGY ROADMAP FOR SILICONE ADHESIVES IN THIN MULTI-CHIP PACKAGESAuthors: S. J. Dent, K. Mine, Y. Ushio, M. J. Watson
Company: Dow Corning Toray Silicones
Date Published: 2/18/2003 Conference: Pan Pacific Symposium
Future die attach adhesives will need to be able to maintain excellent interfacial adhesion to a variety of substrates, and must also be able to do so when exposed to higher temperatures than have been used in the past to assemble device packages. Another important requirement of die attach adhesives is the ability to reproducibly obtain a consistent bondline thickness from part to part so that wire bonding and other downstream manufacturing processes will run smoothly.
When die attach adhesives are used in multi-chip device packages, the adhesive bondline thickness must be decreased along with the thickness of the semiconductor devices in order to reduce the overall package height. Maintaining a consistent adhesive bondline thickness is more difficult when thinner bondlines are used. Furthermore, thinner die are more fragile than die of standard thickness so stress on the package must be reduced in order to prevent the die from cracking when it is mechanically stressed.
Silicone adhesive technology is emerging which can supply adhesives to allow: the use of thinner die in multi-chip device packages, higher temperatures required for lead free solder processing, and bond pads to be closer to the bonded die due to lower silicone migration.
Key words: adhesive, die attach, film adhesive, silicone.
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