Pan Pacific Symposium Conference Proceedings


A STUDY ON THE CONDUCTIVE BEHAVIOR OF COPPER FILLED PASTES FOR MICROELECTRONIC PACKAGING SUBSTRATES

Authors: Shen-Li Fu , YS Lin, SS Chiu, and CS Shi
Company: I-Shou University
Date Published: 2/18/2003   Conference: Pan Pacific Symposium


Abstract: The objective of this study is to investigate the conductive behavior of copper conductive pastes and compressed Cu powders how dependent on powder shape and oxidization on Cu powder at various temperatures. The applied compression pressures and the contact areas between Cu powders are also investigated how to affect the conductive behavior of compressed Cu powders.

The conductive behavior of conductive paste and compressed Cu powders were monitored by the measurement of resistance of cured conductive paste via four-points probe and the resistivity of samples was calculated for comparison. The results of this study indicate the conductive behavior of cured conductive pastes and compressed Cu powders are strongly dependent on the oxidation on Cu powders and slightly dependent on the powder shapes.

The conductive behavior of compressed Cu powders is strongly dependent on the compressed pressures and slightly dependent on the contact areas between Cu powders. The uncoated-Cu powders are easily oxidized and the Ag coating can improve the oxidation-resistance for Cu powders.



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