A STUDY ON THE CONDUCTIVE BEHAVIOR OF COPPER FILLED PASTES FOR MICROELECTRONIC PACKAGING SUBSTRATESAuthors: Shen-Li Fu , YS Lin, SS Chiu, and CS Shi
Company: I-Shou University
Date Published: 2/18/2003 Conference: Pan Pacific Symposium
The conductive behavior of conductive paste and compressed Cu powders were monitored by the measurement of resistance of cured conductive paste via four-points probe and the resistivity of samples was calculated for comparison. The results of this study indicate the conductive behavior of cured conductive pastes and compressed Cu powders are strongly dependent on the oxidation on Cu powders and slightly dependent on the powder shapes.
The conductive behavior of compressed Cu powders is strongly dependent on the compressed pressures and slightly dependent on the contact areas between Cu powders. The uncoated-Cu powders are easily oxidized and the Ag coating can improve the oxidation-resistance for Cu powders.
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