Pan Pacific Symposium Conference Proceedings


ADVANCED VIA FILLING METHODS FOR HDIS APPLICATIONS

Author: S. Pierce
Company: SGP Ventures
Date Published: 2/2/1999   Conference: Pan Pacific Symposium


Abstract: Build-Up Multilayer (BUM) construction has been identified as an enabling technology for Printed Circuit Board (PCB) and Integrated Circuit (IC) packaging manufacturers to produce the High Density Interconnect Structures (HDIS) necessary to meet the future demands of portable electronic products. The permanent filling of the through hole vias in the cores used in typical BUM PCB designs is understood to be an important manufacturing process capability for establishing and maintaining a robust The Flat Plug (FP) process is an established method for via filling, based on advanced screenprinting technology that has been proven in mass production in Japan.

As a result of extensive experimentation, unique equipment has been developed to meet the requirements for a robust via fill process. Consistency of production quality is maintained through the diligent management of material sets and processing parameters.

Building upon a recognized core competency in screenprinting, the FP through-hole via filling technology is in the process of being modified for use in applications that require conductive and non-conductive fill of blind vias in build-up layers. In turn, this will enable PCB designers to take advantage of considerably greater flexibility in high density circuit routing and SMT parts placement.

Keywords: via filling, hole plugging, build-up multilayer



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