ADVANCED VIA FILLING METHODS FOR HDIS APPLICATIONSAuthor: S. Pierce
Company: SGP Ventures
Date Published: 2/2/1999 Conference: Pan Pacific Symposium
As a result of extensive experimentation, unique equipment has been developed to meet the requirements for a robust via fill process. Consistency of production quality is maintained through the diligent management of material sets and processing parameters.
Building upon a recognized core competency in screenprinting, the FP through-hole via filling technology is in the process of being modified for use in applications that require conductive and non-conductive fill of blind vias in build-up layers. In turn, this will enable PCB designers to take advantage of considerably greater flexibility in high density circuit routing and SMT parts placement.
Keywords: via filling, hole plugging, build-up multilayer
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.