AN INVESTIGATION ON THE RELIABILITY OF CSP SOLDER JOINTS WITH NUMEROUS UNDERFILL MATERIALSAuthors: Sunny Zhang, Fowler Chang, and Dr. Shelgon Yee
Company: Solectron Technology Co.
Date Published: 2/18/2003 Conference: Pan Pacific Symposium
This paper will discuss the impact of non-reworkable and reworkable undefill on the mechanical strength of CSPs. Reli-ability tests performed include drop, shear, bending and ther-mal shock tests. The goal is to understand the reliability and degree of protection each of these underfill material offers.
Key words: underfill, CSP, mechanical, reliability.
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