Pan Pacific Symposium Conference Proceedings


AN INVESTIGATION ON THE RELIABILITY OF CSP SOLDER JOINTS WITH NUMEROUS UNDERFILL MATERIALS

Authors: Sunny Zhang, Fowler Chang, and Dr. Shelgon Yee
Company: Solectron Technology Co.
Date Published: 2/18/2003   Conference: Pan Pacific Symposium


Abstract: Underfill technology has been used to minimize the mis-match of the Coefficient of Thermal Expansion (CTE) in flip chip technology. An extension of this underfill technology has been used to increase the mechanical strength of Chip Scale Packages (CSPs).

This paper will discuss the impact of non-reworkable and reworkable undefill on the mechanical strength of CSPs. Reli-ability tests performed include drop, shear, bending and ther-mal shock tests. The goal is to understand the reliability and degree of protection each of these underfill material offers.

Key words: underfill, CSP, mechanical, reliability.



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