EMI-ORIENTED DESIGN OF 3D-PACKED MICROELECTRONICS DEVICESAuthors: A. Brandolini, A. Gandelli and R.E. Zich
Company: Politecnico di Milano
Date Published: 2/18/2003 Conference: Pan Pacific Symposium
Secondary effects downgrading the final performance of 3D devices are taken into account in order to improve accuracy of final results. Especially the mixing of power devices and control leads to more severe restriction in the component placement and layout arrangement. For this reason the role of advanced simulation tools is fundamental for optimal design. New generation of such instruments represents a valid contribution in the development of complex 3D packaging.
Key words: 3D microelectronics, packaging, EMC, EMI, multichip modules.
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