LIFETIME PREDICTION BY FE-SIMULATION AND EXPERIMENTAL VERFICATION FOR VIAS AND MICROVIAS IN HDI-SUBSTRATESAuthor: H.-J. Albrecht et al.
Company: Siemens AG
Date Published: 2/18/2003 Conference: Pan Pacific Symposium
These will lead to the accumulation of permanent irreversible strains and eventually followed by electro-mechanical destruction of the connector either immediately or during fatigue. This work focuses on the numerical analysis of the fatigue process by means of Finite Element (FE) analysis and its experimental verification.
Key words: straight-through vias, microvias, electrolytically deposited copper, lifetime, FE-analysis.
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