Pan Pacific Symposium Conference Proceedings


LIFETIME PREDICTION BY FE-SIMULATION AND EXPERIMENTAL VERFICATION FOR VIAS AND MICROVIAS IN HDI-SUBSTRATES

Author: H.-J. Albrecht et al.
Company: Siemens AG
Date Published: 2/18/2003   Conference: Pan Pacific Symposium


Abstract: During the manufacturing of straight-through vias and other electrical connectors in high-density-substrates (HDS) copper (Cu) is electrolytically deposited. Due to the different thermal expansion coefficients of the copper and of the (elasto-thermally anisotropic) material of the substrate board thermal stresses result within the copper, during the manufacturing process as well as during the ensuing Thermal Cycle Tests (TCTs).

These will lead to the accumulation of permanent irreversible strains and eventually followed by electro-mechanical destruction of the connector either immediately or during fatigue. This work focuses on the numerical analysis of the fatigue process by means of Finite Element (FE) analysis and its experimental verification.

Key words: straight-through vias, microvias, electrolytically deposited copper, lifetime, FE-analysis.



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