Pan Pacific Symposium Conference Proceedings


METHOD AND MATERIAL FOR MAINTAINING CLEANLINESS OF HIGH DENSITY CIRCUITS DURING ASSEMBLY

Authors: Gary M. Freedman and Evelyn Baldwin
Company: Hewlett-Packard and 3M Co.
Date Published: 2/18/2003   Conference: Pan Pacific Symposium


Abstract: The development of a heat resistant tape allows the masking of critical circuit board features during component assembly and rework. Most tapes available use silicone adhesives, which have been found to leave residues when used to mask gold fingers. This new tape has an acrylic-based adhesive on a polyimide backing.

It does not leave any residue on the circuit and can be used to effectively mask gold edge fingers from process contaminants such as solder paste, flux deposits, solder splatter and mechanical damage. This paper summarizes tape attributes and work done to characterize it.

Key words: silicone residue, gold lands, gold finger contamination, polyimide tape.



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