METHOD AND MATERIAL FOR MAINTAINING CLEANLINESS OF HIGH DENSITY CIRCUITS DURING ASSEMBLYAuthors: Gary M. Freedman and Evelyn Baldwin
Company: Hewlett-Packard and 3M Co.
Date Published: 2/18/2003 Conference: Pan Pacific Symposium
It does not leave any residue on the circuit and can be used to effectively mask gold edge fingers from process contaminants such as solder paste, flux deposits, solder splatter and mechanical damage. This paper summarizes tape attributes and work done to characterize it.
Key words: silicone residue, gold lands, gold finger contamination, polyimide tape.
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