NEPCON West - Fiberoptic Expo Conference Proceedings


SOLDER FLUX BEARING LEAD TECHNOLOGY - AN ALTERNATIVE METHOD OF SOLDERING THROUGH HOLE CONNECTORS WITH SMT PROCESSES

Authors: Jim Zanolli and Joe Cachina
Company: Teka Interconnection Systems
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo


Abstract: Mixed technology Printed Circuit Board Assemblies (PCBA) are produced in significantly higher quantities than are 100% SMT or 100% through hole PCBA’s. The typical mixed technology PCBA contains few through hole components. Often the mix of through hole components may only be connectors. As opposed to other active or passive components, the connector must be able to withstand mating and unmating forces or function as a structural member of the assembly.

Through hole connectors will continue to be required as SMT connectors cannot provide the required durability or robustness in many applications. Different methods have been developed to attach or process through hole connectors on mixed technology PCBA’s. These methods include; hand soldering, solder pre-forms, wave, selective wave, light beam, selective soldering and intrusive reflow soldering and solder flux bearing technology (SBL).

The purpose of this paper to show the viability of SBL connectors as an alternative processing solution for mixed technology PCBA’s and to provide reference oven reflow profiles for implementation.

Key words: double sided reflow, pin in paste, intrusive reflow, connector, solder perform, solder bearing lead.



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