NEPCON West - Fiberoptic Expo Conference Proceedings


Author: Kenichi Suzuki et al.
Company: NAMICS Corporation
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo

Abstract: Multimedia and the Internet are creating demand for network throughput enhancements that uses Wavelength Division Multiplexing (WDM) technology. WDM is an effective way to enhance the network throughput easily and is spreading widely. There is a growing movement of Fiber To The Home (FTTH) North America, Japan, and EU, which is a main market. The Fiber Array is one of the composition parts supporting WDM that connects optical fibers with the Planar Lightwave Circuits (PLC) chip.

In today’s market, the demand for 127-micron core pitch Fiber Array is increasing, although the 250-micron has been in general use so far. As a result, It is difficult to acquire sufficient reliability with conventional adhesive for 127-micron core pitch Fiber Array products. We have succeeded in developing high reliability adhesives, which will use an original cationic curing system.

Newly developed Fiber Arrays, which use a precise v-groove with an inventive UV cure-able adhesive, will achieve upper level precision and reliability.

Key words: FTTH, V-groove, UV, adhesive.

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