NEPCON West - Fiberoptic Expo Conference Proceedings


A STUDY OF SMALL AND TAPERED APERTURE TRANSFER EFFICIENCY

Authors: Dr. Gerald Pham-Van-Diep, F. Andres and I. Fleck
Company: Cookson Electronics
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo


Abstract: The objectives of this study are to determine the point at which the stencil printing process becomes inefficient and to compare the difference in performance between aperture geometry (thickness, shape and taper) for typical aperture sizes ranging from 6 to 20 mils. Two laser cut stencil thicknesses (4 and 5 mils) and three levels of positive taper, low (3°), medium (5°) and high (7°), are investigated.

Key words: surface mount, fine feature, transfer efficiencies, solder paste, stencil printing.



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