NEPCON West - Fiberoptic Expo Conference Proceedings


MARKET PULL VS. TECHNOLOGY PUSH: TRENDS IN PHOTONIC DEVICE PACKAGING & AUTOMATED ASSEMBLY AFTER THE BUBBLE

Authors: Edward Palen, Ph.D., P.E.
Company: PalenSolutions - OE Pkg.
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo


Abstract: The Holy Grail was lost and Camelot lay in ruin. King Arthur was morbid, his castle's candles unlit, and the gallant Knights of the Round Table were dispersed and some were already deceased. Will fiber optic assembly wield the sword of Excaliber in automation to return the Kingdom of Photonics to prosperity? Or will it take a combination of Merlin's process assembly knowledge to bring back the light?

The present market situation for telecommunication photonic components is certainly as dark as any Medieval winter's night. Market pull is perceived to be non-existent. Technology push ventures have been slain by both VC financiers and established OEMs. Cash is being conserved.

How long can the market no-pull continue? To be realistic we are still sliding leaving skid marks of closed companies, laid-off telecom employees, closed factories, auctioned equipment and frail nerves along the roadway. Market conditions determine success in all industries. This paper will address the trends in photonic device packaging and automated assembly that may result from the present environment. Challenges and opportunities will be shared.



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