MARKET PULL VS. TECHNOLOGY PUSH: TRENDS IN PHOTONIC DEVICE PACKAGING & AUTOMATED ASSEMBLY AFTER THE BUBBLEAuthors: Edward Palen, Ph.D., P.E.
Company: PalenSolutions - OE Pkg.
Date Published: 12/3/2002 Conference: NEPCON West - Fiberoptic Expo
The present market situation for telecommunication photonic components is certainly as dark as any Medieval winter's night. Market pull is perceived to be non-existent. Technology push ventures have been slain by both VC financiers and established OEMs. Cash is being conserved.
How long can the market no-pull continue? To be realistic we are still sliding leaving skid marks of closed companies, laid-off telecom employees, closed factories, auctioned equipment and frail nerves along the roadway. Market conditions determine success in all industries. This paper will address the trends in photonic device packaging and automated assembly that may result from the present environment. Challenges and opportunities will be shared.
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