NEPCON West - Fiberoptic Expo Conference Proceedings


Authors: Daniel Paine, Ph.D. et al.
Company: Semitool, Inc.
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo

Abstract: Electrodeposited (ED) resist forms a conformal layer over large, three-dimensional structures. It has numerous advantages over the traditional method of spin coating. Whereas spin coating tends to leave the wafer planarized with hard to remove resist plugs, conformal ED resist uniformly covers all surfaces, simplifying the downstream photolithography and stripping processes. Being a zero-waste process, ED resist not only saves on the costs of consumables and disposal, but there are significant cost savings by simplifying ensuing processes.

A comparison between positive and negative ED resist yielded differences in thickness ranges, resolution, surface roughness, baking effects, develop chemistries, and response to voltage changes. Similarities included exposure wavelength sensitivity and strip chemistries. A thorough understanding of these characteristics is necessary to determine which version of ED resist can be used to streamline subsequent processes and reduce costs.

Key words: electrodeposited resist, conformal, three-dimensional, MEMS.

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