THERMAL AGING CHARACTERIZATION OF OSP METAL FINISHING FOR FLIP CHIP PACKAGING WITH FOUR LAYER LAMINATE SUBSTRATEAuthors: Mike C. Loo and Lily Zhao
Company: Philips Semiconductors
Date Published: 12/3/2002 Conference: NEPCON West - Fiberoptic Expo
During high temperature storage, the intermetallic will grow and may result in poor ball adhesion. During the study, it is found that the copper plating quality, especially for the high density four layer substrate, can influence this intermetallic growth behavior. In this paper, first, the configuration of the flip chip package with four layer laminate substrate will be presented. Second, the effect of storage temperature, time, and copper plating quality on the intermetallic microstructure and ball adhesion will be discussed.
Key words: four layer flip chip BGA, OSP, high temperature storage, copper plating, intermetallic.
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