NEPCON West - Fiberoptic Expo Conference Proceedings


FINITE ELEMENT MODELING OF BALL GRID ARRAY PACKAGES IN SYSTEM PACKAGING VIBRATION ANALYSIS

Author: Ron S. Li
Company: Motorola, Inc.
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo


Abstract: In many cases, components need to be placed in a system level model for mechanical performance analysis. For example, at a given boundary condition, location of a component can significantly impact its mechanical performance such as thermal and vibration.

This paper addresses an approach to modeling of Plastic Ball Grid Array (PBGA) component in system level vibration analysis. Every single solder ball is modeled in this system level model. Stress level can be identified on each of the solder balls. Power spectral density of stresses on any solder ball can also be obtained for statistical analysis such as positive zero cross frequency and its moments.

This is particularly useful in fatigue analysis of solder balls under random vibration. Experimental observations and correlation are also discussed to validate the modeling approach. Compared with the traditional global/local modeling approach where component analysis is separated from the system level model, the approach presented in this paper gives a nonparallel mean to assist board layout in early design stage, to correlate failure modes and to predict fatigue lives.



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