NEPCON West - Fiberoptic Expo Conference Proceedings


Author: Frank Juskey
Company: Advanced Interconnect Tech.
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo

Abstract: System-In-Package (SIP) is an emerging technology within the traditional chip and wire IC packaging industry. The major difference between the MCMs of yesterday and the system-in-package of today is the use of smaller die with improved yields at the wafer level, and the integration of extremely reliable surface-mounted components. The need for OEMs to get their products to market faster has driven the traditionally designers of discreet components to integrate increased functionality into their products.

Due to the complexity of design and the inherent costs associated with silicon real estate, the integration of functionality into a system-on-chip (SOC) is not as feasible from a cost or time-to-market perspective as system-in -package provides. This is particularly true for cellular handset designers, who increasingly must support multiple standards, modes and technologies.

This paper discusses the obstacles associated with substrates, integration of SMT into a traditional IC assembly process, supply chain management, and logistics of handling a cellular handset BOM that now has many different part numbers.

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