SYSTEM-IN-PACKAGE: A WIRELESS SOLUTION FOR CELL PHONESAuthor: Frank Juskey
Company: Advanced Interconnect Tech.
Date Published: 12/3/2002 Conference: NEPCON West - Fiberoptic Expo
Due to the complexity of design and the inherent costs associated with silicon real estate, the integration of functionality into a system-on-chip (SOC) is not as feasible from a cost or time-to-market perspective as system-in -package provides. This is particularly true for cellular handset designers, who increasingly must support multiple standards, modes and technologies.
This paper discusses the obstacles associated with substrates, integration of SMT into a traditional IC assembly process, supply chain management, and logistics of handling a cellular handset BOM that now has many different part numbers.
Members download articles for free:
Not a member yet?
What else do you get when you join SMTA? Read about all of the benefits that go along with membership.
Notice: Sharing of articles is restricted to just your immediate work group. Downloaded papers should not be stored on an external network or shared on the internet.