NEPCON West - Fiberoptic Expo Conference Proceedings


LEAD-FREE SOLDER INTERCONNECTIONS FOR SMT MANUFACTURING

Author: Dr. Jennie S. Hwang
Company: H-Technologies Group, Inc.
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo


Abstract: The environmental stewardship is becoming an integral part of corporate policies. The issue of lead in electronics has been going through deliberations and debates by the legislative bodies, manufacturers, professional organizations, and individuals around the world. In the meantime, the lead-free technology has been established as a result of over twelve-year sustained research. This year the industry has reached the momentum in pursuing lead-free manufacturing. What are the viable lead-free compositions, what are the selection criteria and the reasons behind the selection criteria? This paper is intended to provide the summary information and rationale to these questions.



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