NEPCON West - Fiberoptic Expo Conference Proceedings


Authors: Tony Huang and Rudolph Yu
Company: Adaptec, Inc.
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo

Abstract: With the trend in the consumer electronic products to use the smaller electronic packages on the board design, the 0201 chip has become a challenging component to printed circuit board assemblers. The areas such as board design, assembly process, inspection method, rework process, and solder joint reliability need to be reviewed before 0201 chips are implemented onto the board design.

The paper presents the results and recommendations from an evaluation of a 0201 implementation project. This paper demonstrates the methods used on each phase of evaluation. Design of Experiment (DOE) was used on screen print process to study the critical parameters of stencil design and printing process setup. A methodology was developed to evaluate the placement process window against footprint design. Throughout the analysis of the experimental results, PCB design, stencil design, and process parameters will be discussed, and recommendations will be made.

In addition, in-depth comparison and study among AOI (Automated Optical Inspection), X-ray and video microscope inspection were reviewed. The rework tool and methods were also evaluated and discussed. Finally, shock and vibration and thermal cycling were performed to exam the solder joint reliability.

Key words: 0201, DFM, AOI, DOE.

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