NEPCON West - Fiberoptic Expo Conference Proceedings


OPTOELECTRONIC PACKAGING CONCEPTS USING ACTIVE POLYMER SYSTEMS

Authors: Leo M. Higgins III, Ph.D.
Company: Siemens Dematic EAS
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo


Abstract: It is becoming increasingly common for vertical cavity surface emitting lasers and photodiodes to be packaged using non-hermetic technologies. In most cases, transceivers incorporating edge emitting semiconductor lasers and photodiodes are fabricated using hermetic materials and seals to protect them from contamination or corrosion from the application environment. The entire transceiver may be packaged in a hermetic module, or the laser and photodiode may be packaged in hermetic TO cans and then combined with other non-hermetic components in the construction of a lower cost product.

Advanced polymer materials, such as liquid crystal polymer, can provide near-hermetic packaging for sensitive photonic devices, but some concerns regarding permeability of these materials and the package seals defer some manufacturers from considering low cost polymeric packaging. In other industries it is quite common for specific polymers to be selected for use due to their characteristics as barriers to permeability by certain gases. When an enclosure or package is required to impede ingress by more than one gaseous species, it is normal to create layered constructions from materials selected for their individual diffusion barrier attributes.

Metal films are also often used in conjunction with these multiplayer polymer barriers to further enhance barrier effects, and to prevent optical radiation from penetrating the enclosure. Polymer systems containing constituents that react with use environment atmospheric species or contaminants have also been formulated. These active polymer systems are proving to be good barriers to penetration by water vapor, oxygen, carbon dioxide, and other gaseous materials.

In this paper, multilayer polymer constructs and active polymer systems, which present efficient gas phase diffusion barriers, will be reviewed. Concepts for the use of such material systems for Optoelectronic packaging will be presented. Exploitation of these material and process technologies to add a final level of near-hermeticity, to allow lower cost packaging will be discussed.

Key words: optoelectronic packaging, active polymers, non-hermetic, polymer packaging.



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