THE OPTOELECTRONIC ASSEMBLY WORKCELLAuthors: Ray Gottsleben and Steve Sytsma*
Company: Arlink Systems and RRA*
Date Published: 12/3/2002 Conference: NEPCON West - Fiberoptic Expo
The core information presented focuses on flexible work cell design, tool and process selection, along with assembly setup methods to allow for highly flexible, high-yield assembly and test of Optoelectronic Level 1 devices, Level 2 subassemblies and Level 3 assemblies. Typical facility, setup, reconfiguration and changeover considerations such as process flow, floor layout, process reconfiguration, and effectively managing resources in a multi-shift operation, are keyed upon. Common processing issues and manufacturing problems are discussed with an eye toward avoidance and effective resolution.
Cost of Ownership concerns are addressed along with Cost of Use, Production cost and Cost of Quality drivers. Production methods are established to allow for the initiation of a Best Assembly Practices program. A methodology is offered to ascertain production needs and quantitatively select the most effective manufacturing solutions. Supporting information is developed to expose significant technical relationships between closely related subjects.
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