NEPCON West - Fiberoptic Expo Conference Proceedings


Authors: Ray Gottsleben and Steve Sytsma*
Company: Arlink Systems and RRA*
Date Published: 12/3/2002   Conference: NEPCON West - Fiberoptic Expo

Abstract: As Optoelectronic and Photonic assembly processes mature, increasing levels of automation will be developed and implemented. But in the meantime, Optoelectronic and Photonic manufacturing will continue to be a series of manual or semi automated assembly processes. This paper, written by the current industry leaders in Optoelectronic process machines, materials, tools and services, outlines the machines, materials and tools necessary to either establish an Optoelectronics and Photonics assembly capability or cost-effectively expand current manufacturing capacity.

The core information presented focuses on flexible work cell design, tool and process selection, along with assembly setup methods to allow for highly flexible, high-yield assembly and test of Optoelectronic Level 1 devices, Level 2 subassemblies and Level 3 assemblies. Typical facility, setup, reconfiguration and changeover considerations such as process flow, floor layout, process reconfiguration, and effectively managing resources in a multi-shift operation, are keyed upon. Common processing issues and manufacturing problems are discussed with an eye toward avoidance and effective resolution.

Cost of Ownership concerns are addressed along with Cost of Use, Production cost and Cost of Quality drivers. Production methods are established to allow for the initiation of a Best Assembly Practices program. A methodology is offered to ascertain production needs and quantitatively select the most effective manufacturing solutions. Supporting information is developed to expose significant technical relationships between closely related subjects.

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